日本高純度化学 Hisse Grafiği

Japan Pure Chemical Co., Ltd. engages in the development, manufacture and sale of noble metal plating chemicals for electronic devices. It offers gold electroplating formulation for semiconductor applications, connectors, contacts, and soldering uses, and palladium electroplating formulation for connectors, lead frames, and decorative uses. The company provides gold coating for soldering and wire bonding, electro less palladium plating formulation for wire bonding and soldering uses, and silver plating formulations. It also engages in the non-cyanide immersion silver plating formulations on Cu surfaces, anti bacterial agents for plating tanks and drag-out tank, impurity removal resin that removes Cu ions dissolved in Au and Pd bath solutions, and carbon filter that is applied to JPC plating chemicals. The company was founded on July 16, 1971 and is headquartered in Tokyo, Japan.